Journal of
Systemics, Cybernetics and Informatics
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ISSN: 1690-4524 (Online)


Peer Reviewed Journal via three different mandatory reviewing processes, since 2006, and, from September 2020, a fourth mandatory peer-editing has been added.

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Published by
The International Institute of Informatics and Cybernetics


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Honorary Editorial Advisory Board's Chair
William Lesso (1931-2015)

Editor-in-Chief
Nagib C. Callaos


Sponsored by
The International Institute of
Informatics and Systemics

www.iiis.org
 

Editorial Advisory Board

Quality Assurance

Editors

Journal's Reviewers
Call for Special Articles
 

Description and Aims

Submission of Articles

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Information to Contributors

Editorial Peer Review Methodology

Integrating Reviewing Processes


Transfer Learning for Facial Emotion Recognition on Small Datasets
Paolo Barile, Clara Bassano, Paolo Piciocchi
(pages: 1-5)

How to Link Educational Purposes and Immersive Video Games Development? An Ontological Approach Proposal
Nathan Aky
(pages: 6-13)

Application of Building Information Modeling (BIM) in the Planning and Construction of a Building
Renata Maria Abrantes Baracho, Luiz Gustavo da Silva Santiago, Antonio Tagore Assumpção Mendoza e Silva, Marcelo Franco Porto
(pages: 14-19)

Transformative, Transdisciplinary, Transcendent Digital Education: Synergy, Sustainability and Calamity
Rusudan Makhachashvili, Ivan Semenist
(pages: 20-27)

New Online Tools for the Data Visualization of Bivalve Molluscs' Production Areas of Veneto Region
Eleonora Franzago, Claudia Casarotto, Matteo Trolese, Marica Toson, Mirko Ruzza, Manuela Dalla Pozza, Grazia Manca, Giuseppe Arcangeli, Nicola Ferrè, Laura Bille
(pages: 28-32)

Geodata Processing Methodology on GIS Platforms When Creating Spatial Development Plans of Territorial Communities: Case of Ukraine
Olena Kopishynska, Yurii Utkin, Ihor Sliusar, Leonid Flehantov, Mykola Somych, Oksana Yakovlieva, Olena Scryl
(pages: 33-40)

D-CIDE: An Interactive Code Learning Program
Lukas Grant, Matthew F. Tennyson, Jason Owen
(pages: 41-46)

Interdisciplinary Digital Skills Development for Educational Communication: Emergency and Ai-Enhanced Digitization
Rusudan Makhachashvili, Ivan Semenist, Ganna Prihodko, Irina Kolegaeva, Olexandra Prykhodchenko, Olena Tupakhina
(pages: 47-51)

Interdisciplinarity in Smart Systems Applied to Rural School Transport in Brazil
Renata Maria Abrantes Baracho, Mozart Joaquim Magalhães Vidigal, Marcelo Franco Porto, Beatriz Couto
(pages: 52-59)

Peculiarities of the Realization of IT Projects for the Implementation of ERP Systems on the Path of Digitalization of Territorial Communities Activities
Olena Kopishynska, Yurii Utkin, Ihor Sliusar, Khanlar Makhmudov, Olena Kalashnyk, Svitlana Moroz, Olena Kyrychenko
(pages: 60-67)


 

Abstracts

 


ABSTRACT


New Architecture of Optical Interconnect for High-Speed Optical Computerized Data Networks (Nonlinear Response)

El-Sayed A. El-Badawy, Farag Z. El-Halafawy, Hamdy A. Kelash, Ashraf M. Abou-Tabl


Although research into the use of optics in computers has increased in the last and current decades, the fact remains that electronics is still superior to optics in almost every way. Research into the use of optics at this stage mirrors the research into electronics after the 2nd World War. The advantages of using fiber optics over wiring are the same as the argument for using optics over electronics in computers. Even through totally optical computers are now a reality, computers that combine both electronics and optics, electro-optic hybrids, have been in use for some time. In the present paper, architecture of optical interconnect is built up on the bases of four Vertical-Cavity Surface- Emitting Laser Diodes (VCSELD) and two optical links where thermal effects of both the diodes and the links are included. Nonlinear relations are correlated to investigate the power-current and the voltage-current dependences of the four devices. The good performance (high speed) of the interconnect is deeply and parametrically investigated under wide ranges of the affecting parameters. The high speed performance is processed through three different effects, namely the device 3-dB bandwidth, the link dispersion characteristics, and the transmitted bit rate (soliton). Eight combinations are investigated; each possesses its own characteristics. The best architecture is the one composed of VCSELD that operates at 850 nm and the silica fiber whatever the operating set of causes. This combination possesses the largest device 3-dB bandwidth, the largest link bandwidth and the largest soliton transmitted bit rate. The increase of the ambient temperature reduces the high-speed performance of the interconnect

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