Journal of
Systemics, Cybernetics and Informatics
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ISSN: 1690-4524 (Online)


Peer Reviewed Journal via three different mandatory reviewing processes, since 2006, and, from September 2020, a fourth mandatory peer-editing has been added.

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Published by
The International Institute of Informatics and Cybernetics


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Academia.edu
(A Community of about 40.000.000 Academics)


Honorary Editorial Advisory Board's Chair
William Lesso (1931-2015)

Editor-in-Chief
Nagib C. Callaos


Sponsored by
The International Institute of
Informatics and Systemics

www.iiis.org
 

Editorial Advisory Board

Quality Assurance

Editors

Journal's Reviewers
Call for Special Articles
 

Description and Aims

Submission of Articles

Areas and Subareas

Information to Contributors

Editorial Peer Review Methodology

Integrating Reviewing Processes


Quantitative Endosurgery Process Analysis by Machine Learning Method
Bojan Nokovic, Andrew Lambe
(pages: 1-7)

Modelling Student Performance in a Structural Steel Graduate-Based Module: A Comparative Analysis Between K-Nearest Neighbor and Dummy Classifiers
Masengo Ilunga, Omphemetse Zimbili, Phahlani Mampilo, Agarwal Abhishek
(pages: 8-15)

Interoperable Digital Skills for Foreign Languages Education in the COVID-19 Paradigm
Rusudan Makhachashvili, Ivan Semenist, Iryna Vorotnykova
(pages: 16-20)

Education, Training and Informatics Go Hand in Hand in (Foreign) Higher Education Institutions (HEIs) – Case Studies From Live and Online Classrooms
Ekaterini Nikolarea
(pages: 21-29)

Enhancing Pedagogical and Digital Competencies Through Digital Tools: A Proposal for Semi-schooled Language Teaching Programs in Oaxaca, Mexico
José de Jesús Bautista Hernández, Eduardo Bustos Farías, Norma Patricia Maldonado Reynoso
(pages: 30-35)

Railway Track Degradation Modelling Using Finite Element Analysis: A Case Study in South Africa
Ntombela Lunga, Masengo Ilunga
(pages: 36-50)

Continuum of Academic Collaboration: Issues of Inconsistent Terminology in Multilingual Context
Cristo Leon, James Lipuma, Marcos O. Cabobianco, Maria B. Daizo
(pages: 51-62)

Peat Resource Management and Climate Change Mitigation Issues – Case of Latvia
Anita Titova, Natalja Lace
(pages: 63-70)

Using Geospatial Computation Intelligence for Mapping Temporal Evolution of Urban Built-up in Selected Areas of the Ekurhuleni Municipality, South Africa
Jo-Anne Correia, Masengo Ilunga
(pages: 71-80)

Cybernetics and Informatics of Generative AI for Transdisciplinary Communication in Education
Rusudan Makhachashvili, Ivan Semenist
(pages: 81-88)

Navigating Psychological Riptides: How Seafarers Cope and Seek Help for Mental Health Needs
Coleen Abadicio, Stella Louise Arenas, Rosette Renee Hahn, Angel Berry Maleriado, Ramon Miguel Mariano, Rodolfo Antonio Ma. Zabella, Genejane Adarlo
(pages: 89-98)


 

Abstracts

 


ABSTRACT


New Architecture of Optical Interconnect for High-Speed Optical Computerized Data Networks (Nonlinear Response)

El-Sayed A. El-Badawy, Farag Z. El-Halafawy, Hamdy A. Kelash, Ashraf M. Abou-Tabl


Although research into the use of optics in computers has increased in the last and current decades, the fact remains that electronics is still superior to optics in almost every way. Research into the use of optics at this stage mirrors the research into electronics after the 2nd World War. The advantages of using fiber optics over wiring are the same as the argument for using optics over electronics in computers. Even through totally optical computers are now a reality, computers that combine both electronics and optics, electro-optic hybrids, have been in use for some time. In the present paper, architecture of optical interconnect is built up on the bases of four Vertical-Cavity Surface- Emitting Laser Diodes (VCSELD) and two optical links where thermal effects of both the diodes and the links are included. Nonlinear relations are correlated to investigate the power-current and the voltage-current dependences of the four devices. The good performance (high speed) of the interconnect is deeply and parametrically investigated under wide ranges of the affecting parameters. The high speed performance is processed through three different effects, namely the device 3-dB bandwidth, the link dispersion characteristics, and the transmitted bit rate (soliton). Eight combinations are investigated; each possesses its own characteristics. The best architecture is the one composed of VCSELD that operates at 850 nm and the silica fiber whatever the operating set of causes. This combination possesses the largest device 3-dB bandwidth, the largest link bandwidth and the largest soliton transmitted bit rate. The increase of the ambient temperature reduces the high-speed performance of the interconnect

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