Journal of
Systemics, Cybernetics and Informatics
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ISSN: 1690-4524 (Online)


Peer Reviewed Journal via three different mandatory reviewing processes, since 2006, and, from September 2020, a fourth mandatory peer-editing has been added.

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Published by
The International Institute of Informatics and Cybernetics


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Academia.edu
(A Community of about 40.000.000 Academics)


Honorary Editorial Advisory Board's Chair
William Lesso (1931-2015)

Editor-in-Chief
Nagib C. Callaos


Sponsored by
The International Institute of
Informatics and Systemics

www.iiis.org
 

Editorial Advisory Board

Quality Assurance

Editors

Journal's Reviewers
Call for Special Articles
 

Description and Aims

Submission of Articles

Areas and Subareas

Information to Contributors

Editorial Peer Review Methodology

Integrating Reviewing Processes


Utilization of Artificial Intelligence by Students in Interdisciplinary Field of Biomedical Engineering
Shigehiro Hashimoto
(pages: 1-5)

Transdisciplinary Applications of Data Visualization and Data Mining Techniques as Represented for Human Diseases
Richard S. Segall
(pages: 6-15)

Beyond Status Quo: Why is Transdisciplinary Communication Instrumental in Innovation?
James Lipuma, Cristo Leon
(pages: 16-20)

How We Can Locate Validatable Foundations of Life Themes
Jeremy Horne
(pages: 21-32)

Bringing Discipline into Transdisciplinary Communications -The ISO 56000 Family of Innovation Standards-
Rick Fernandez, William Swart
(pages: 33-39)

To AI Is Human: How AI Tools with Their Imperfections Enhance Learning
Martin Cwiakala
(pages: 40-46)

Knowledge, Learning and Transdisciplinary Communication in the Evolution of the Contemporary World
Rita Micarelli, Giorgio Pizziolo
(pages: 47-52)

Human Complexity vs. Machine Linearity: Tug-of-War Between Two Realities Coexisting in Precarious Balance
Paolo Barile, Clara Bassano, Paolo Piciocchi
(pages: 53-62)

A Cybernetic Metric Approach to Course Preparation
Russell Jay Hendel
(pages: 63-70)

The Impact of Artificial Intelligence on Education
John Jenq
(pages: 71-76)

Bridging the Gap: Harnessing the Power of Machine Learning and Big Data for Media Research
Li-jing Arthur Chang
(pages: 77-84)

Image Processing, Computer Vision, Data Visualization, and Data Mining for Transdisciplinary Visual Communication: What Are the Differences and Which Should or Could You Use?
Richard S. Segall
(pages: 85-92)

Identification – The Essence of Education
Jeremy Horne
(pages: 93-99)

The Greek-Roman Theatre in the Mediterranean Area
Maria Rosaria D’acierno Canonici Cammino
(pages: 100-108)

Examination of AI and Conventional Teaching Approaches in Cultivating Critical Thinking Skills in High School Students
Luis Castillo
(pages: 109-112)

Thoughts, Labyrinths, and Torii
Maurício Vieira Kritz
(pages: 113-119)

Can Two Human Intelligences (HIs or Noes) and Two Artificial Intelligences (AIs) Get Involved in Interlinguistic Communication? – A Transdisciplinary Quest
Ekaterini Nikolarea
(pages: 120-128)


 

Abstracts

 


ABSTRACT


New Architecture of Optical Interconnect for High-Speed Optical Computerized Data Networks (Nonlinear Response)

El-Sayed A. El-Badawy, Farag Z. El-Halafawy, Hamdy A. Kelash, Ashraf M. Abou-Tabl


Although research into the use of optics in computers has increased in the last and current decades, the fact remains that electronics is still superior to optics in almost every way. Research into the use of optics at this stage mirrors the research into electronics after the 2nd World War. The advantages of using fiber optics over wiring are the same as the argument for using optics over electronics in computers. Even through totally optical computers are now a reality, computers that combine both electronics and optics, electro-optic hybrids, have been in use for some time. In the present paper, architecture of optical interconnect is built up on the bases of four Vertical-Cavity Surface- Emitting Laser Diodes (VCSELD) and two optical links where thermal effects of both the diodes and the links are included. Nonlinear relations are correlated to investigate the power-current and the voltage-current dependences of the four devices. The good performance (high speed) of the interconnect is deeply and parametrically investigated under wide ranges of the affecting parameters. The high speed performance is processed through three different effects, namely the device 3-dB bandwidth, the link dispersion characteristics, and the transmitted bit rate (soliton). Eight combinations are investigated; each possesses its own characteristics. The best architecture is the one composed of VCSELD that operates at 850 nm and the silica fiber whatever the operating set of causes. This combination possesses the largest device 3-dB bandwidth, the largest link bandwidth and the largest soliton transmitted bit rate. The increase of the ambient temperature reduces the high-speed performance of the interconnect

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